PCB-SAGE: LLM-Assisted Security Assessment with Grounded Evidence Across PCB Artifacts
in Proc. IEEE Physical Assurance and Inspection of Electronics (PAINE), 2026 — accepted for publication.
An evidence-grounded, LLM-assisted workflow that assesses security exposures across printed-circuit-board design artifacts and links every finding back to concrete assurance evidence across the PCB assembly lifecycle.
@inproceedings{mirfasihi2026pcbsage,
title = {PCB-SAGE: LLM-Assisted Security Assessment with Grounded Evidence Across PCB Artifacts},
author = {Mirfasihi, Parsa and Ghazali, S. and Ramus, X. and Chowdhury, Muhtasim Alam and Ghimire, Sujan and Satam, Pratik and Salehi, Soheil},
booktitle = {Proceedings of the IEEE Physical Assurance and Inspection of Electronics (PAINE)},
year = {2026},
note = {Accepted for publication}
}